SN74AVC8T245RHLR
vs
SN74AVCH32T245ZKER
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFN
|
BGA
|
| Package Description |
QFN-24
|
LFBGA-96
|
| Pin Count |
24
|
96
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Control Type |
COMMON CONTROL
|
COMMON CONTROL
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
AVC
|
AVC
|
| JESD-30 Code |
R-PQCC-N24
|
R-PBGA-B96
|
| JESD-609 Code |
e4
|
e1
|
| Length |
5.5 mm
|
13.5 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Max I(ol) |
0.012 A
|
0.012 A
|
| Moisture Sensitivity Level |
2
|
3
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
4
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
96
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LFBGA
|
| Package Equivalence Code |
LCC24/28,.14X.2,20
|
BGA96,6X16,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Packing Method |
TR
|
TR
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Supply Current-Max (ICC) |
0.025 mA
|
0.09 mA
|
| Prop. Delay@Nom-Sup |
17.2 ns
|
6.2 ns
|
| Propagation Delay (tpd) |
17.2 ns
|
6.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.4 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
1.2 V
|
| Supply Voltage-Nom (Vsup) |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3.5 mm
|
5.5 mm
|
| Base Number Matches |
2
|
1
|
| Load Capacitance (CL) |
|
15 pF
|
|
|
|
Compare SN74AVC8T245RHLR with alternatives
Compare SN74AVCH32T245ZKER with alternatives