SN74BCT8240ADWR
vs
SN54BCT8240AFK
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
QCCN,
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
SUPPORTS IEEE STANDARD 1149.1-1990 BOUNDARY SCAN
|
|
| Family |
BCT/FBT
|
BCT/FBT
|
| JESD-30 Code |
R-PDSO-G24
|
S-CQCC-N28
|
| JESD-609 Code |
e4
|
|
| Length |
15.4 mm
|
11.43 mm
|
| Logic IC Type |
BOUNDARY SCAN BUS DRIVER
|
BOUNDARY SCAN BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
4
|
4
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
28
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
8 ns
|
9 ns
|
| Seated Height-Max |
2.65 mm
|
2.03 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.5 mm
|
11.43 mm
|
| Base Number Matches |
2
|
2
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare SN74BCT8240ADWR with alternatives
Compare SN54BCT8240AFK with alternatives