SN74CB3Q32245GKER vs SN74CB3Q32245ZKER feature comparison

SN74CB3Q32245GKER Texas Instruments

Buy Now Datasheet

SN74CB3Q32245ZKER Texas Instruments

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description LFBGA-96 GREEN, PLASTIC, LFBGA-96
Pin Count 96 96
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW ENABLE LOW
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family CB3Q/3VH/3C/2B CB3Q/3VH/3C/2B
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0 e1
Length 13.5 mm 13.5 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 2 3
Number of Bits 8 8
Number of Functions 4 32
Number of Ports 2 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 235 260
Power Supply Current-Max (ICC) 4 mA 4 mA
Prop. Delay@Nom-Sup 0.3 ns 0.3 ns
Propagation Delay (tpd) 0.3 ns 0.3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Width 5.5 mm 5.5 mm
Base Number Matches 1 1

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