SN74CBTLV3257DGV
vs
74CBTLV3257D,118
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NEXPERIA
|
| Part Package Code |
SOIC
|
SOP
|
| Package Description |
TSSOP, TSSOP16,.25,16
|
SOP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Control Type |
ENABLE LOW
|
ENABLE LOW
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
CBTLV/3B
|
CBTLV/3B
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
4.4 mm
|
9.9 mm
|
| Load Capacitance (CL) |
30 pF
|
50 pF
|
| Logic IC Type |
BUS EXCHANGER
|
BUS EXCHANGER
|
| Number of Bits |
2
|
4
|
| Number of Functions |
4
|
1
|
| Number of Inputs |
1
|
1
|
| Number of Outputs |
2
|
2
|
| Number of Ports |
3
|
3
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Equivalence Code |
TSSOP16,.25,16
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
0.01 mA
|
0.05 mA
|
| Prop. Delay@Nom-Sup |
0.35 ns
|
0.25 ns
|
| Propagation Delay (tpd) |
0.35 ns
|
0.25 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.6 mm
|
3.9 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Manufacturer Package Code |
|
SOT109-1
|
| Factory Lead Time |
|
6 Weeks
|
| Samacsys Manufacturer |
|
Nexperia
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR, 13 INCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SN74CBTLV3257DGV with alternatives
Compare 74CBTLV3257D,118 with alternatives