SN74F153NSRG4
vs
54F153SDM
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP16,.3
|
DIP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-PDSO-G16
|
R-CDIP-T16
|
| JESD-609 Code |
e4
|
|
| Length |
10.2 mm
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.02 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
2
|
| Number of Inputs |
4
|
4
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
20 mA
|
|
| Prop. Delay@Nom-Sup |
12 ns
|
|
| Propagation Delay (tpd) |
8 ns
|
11 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5.3 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare SN74F153NSRG4 with alternatives
Compare 54F153SDM with alternatives