SN74GTLP1394RGYR
vs
935264009118
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
TSSOP
|
| Package Description |
HVQCCN, LCC16/20,.14X.16,20
|
TSSOP,
|
| Pin Count |
16
|
56
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
GTLP
|
|
| JESD-30 Code |
R-PQCC-N16
|
R-PDSO-G56
|
| Length |
4 mm
|
14 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
REGISTERED BUS TRANSCEIVER
|
| Number of Bits |
2
|
1
|
| Number of Functions |
1
|
18
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
16
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
OPEN-COLLECTOR/3-STATE
|
| Output Polarity |
CONFIGURABLE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Equivalence Code |
LCC16/20,.14X.16,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Propagation Delay (tpd) |
9 ns
|
5.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.45 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
3.5 mm
|
6.1 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare SN74GTLP1394RGYR with alternatives
Compare 935264009118 with alternatives