SN74HC00-W
vs
74HC00D/T3
feature comparison
| Pbfree Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
WAFER
|
SOIC
|
| Package Description |
DIE,
|
3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-XUUC-N
|
R-PDSO-G14
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
115 ns
|
135 ns
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UPPER
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Pin Count |
|
14
|
| JESD-609 Code |
|
e4
|
| Length |
|
8.65 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
14
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.75 mm
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
3.9 mm
|
|
|
|
Compare SN74HC00-W with alternatives
Compare 74HC00D/T3 with alternatives