SN74HC00-W vs M74HC00B1R feature comparison

SN74HC00-W Texas Instruments

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M74HC00B1R STMicroelectronics

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Pbfree Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC STMICROELECTRONICS
Part Package Code WAFER DIP
Package Description DIE, PLASTIC, DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-XUUC-N R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 115 ns 110 ns
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 1 1
Rohs Code Yes
Pin Count 14
Samacsys Manufacturer STMicroelectronics
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Number of Terminals 14
Package Equivalence Code DIP14,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 22 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 5.1 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 2.54 mm
Width 7.62 mm

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