SN74HC00DR-00 vs TC74HC00APF feature comparison

SN74HC00DR-00 Texas Instruments

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TC74HC00APF Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TOSHIBA CORP
Package Description SOP, DIP, DIP14,.3
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 8.65 mm 19.25 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 23 ns 95 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.45 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 14
Factory Lead Time 53 Weeks, 1 Day
Samacsys Manufacturer Toshiba
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 19 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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