SN74HC00J4
vs
TC74HC00APF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
TOSHIBA CORP
Package Description
,
0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC
HC/UH
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
Length
19.56 mm
19.25 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.0052 A
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
0.02 mA
Prop. Delay@Nom-Sup
23 ns
19 ns
Propagation Delay (tpd)
115 ns
95 ns
Schmitt Trigger
NO
NO
Seated Height-Max
5.08 mm
4.45 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
14
Samacsys Manufacturer
Toshiba
Packing Method
TUBE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Temperature Grade
INDUSTRIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare SN74HC00J4 with alternatives
Compare TC74HC00APF with alternatives