SN74HC00NP3
vs
SN54HC00J
feature comparison
Part Life Cycle Code |
Active
|
Contact Manufacturer
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
Package Description |
,
|
DIP,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
DIP
|
Pin Count |
|
14
|
Additional Feature |
|
LG-MAX
|
Family |
|
HC/UH
|
JESD-30 Code |
|
R-GDIP-T14
|
Length |
|
19.94 mm
|
Number of Functions |
|
4
|
Number of Inputs |
|
2
|
Number of Terminals |
|
14
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
|
CERAMIC, GLASS-SEALED
|
Package Code |
|
DIP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Propagation Delay (tpd) |
|
135 ns
|
Seated Height-Max |
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
|
6 V
|
Supply Voltage-Min (Vsup) |
|
2 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
MILITARY
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
7.62 mm
|
|
|
|
Compare SN74HC00NP3 with alternatives
Compare SN54HC00J with alternatives