SN74HC00NP3 vs TC74HC00AP feature comparison

SN74HC00NP3 Rochester Electronics LLC

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TC74HC00AP Toshiba America Electronic Components

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC TOSHIBA CORP
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Logic IC Type NAND GATE NAND GATE
Base Number Matches 2 1
Rohs Code Yes
Part Package Code DIP
Pin Count 14
Samacsys Manufacturer Toshiba
Family HC/UH
JESD-30 Code R-PDIP-T14
Length 19.25 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 19 ns
Propagation Delay (tpd) 95 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.45 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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