SN74HC03NR vs MM74HCT00MX feature comparison

SN74HC03NR Texas Instruments

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MM74HCT00MX onsemi

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Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer TEXAS INSTRUMENTS INC ONSEMI
Package Description DIP, SOIC-14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.305 mm 8.6235 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 131 ns 29 ns
Seated Height-Max 5.08 mm 1.753 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 5
Pbfree Code Yes
Manufacturer Package Code 751EF
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 29 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare SN74HC03NR with alternatives

Compare MM74HCT00MX with alternatives