SN74HC688PWT
vs
MC74HC688NS
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
TSSOP
|
|
| Package Description |
GREEN, PLASTIC, TSSOP-20
|
,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Family |
HC/UH
|
|
| JESD-30 Code |
R-PDSO-G20
|
|
| JESD-609 Code |
e4
|
|
| Length |
6.5 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
IDENTITY COMPARATOR
|
IDENTITY COMPARATOR
|
| Max I(ol) |
0.0052 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
20
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP20,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
0.08 mA
|
|
| Prop. Delay@Nom-Sup |
45 ns
|
|
| Propagation Delay (tpd) |
265 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
|
| Base Number Matches |
3
|
1
|
|
|
|
Compare SN74HC688PWT with alternatives
Compare MC74HC688NS with alternatives