SN74LS10N vs JM38510/30005BCC feature comparison

SN74LS10N Rochester Electronics LLC

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JM38510/30005BCC NXP Semiconductors

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Pbfree Code No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC SIGNETICS CORP
Part Package Code DIP
Package Description ROHS COMPLIANT, PLASTIC, MS-001AA, DIP-14 ,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e0
Length 19.305 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 15 ns 15 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 6 3
Load Capacitance (CL) 15 pF
Power Supply Current-Max (ICC) 3.3 mA
Qualification Status Not Qualified

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