SN74LS190JDS
vs
SN74LS190JD
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA INC
|
| Package Description |
DIP, DIP16,.3
|
DIP, DIP16,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| JESD-30 Code |
R-XDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Load/Preset Input |
YES
|
YES
|
| Logic IC Type |
DECADE COUNTER
|
DECADE COUNTER
|
| Mode of Operation |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supplies |
5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
3
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
TCO OUTPUT
|
| Family |
|
LS
|
| Length |
|
19.495 mm
|
| Number of Bits |
|
4
|
| Propagation Delay (tpd) |
|
36 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
|
4.75 V
|
| Trigger Type |
|
POSITIVE EDGE
|
| Width |
|
7.62 mm
|
| fmax-Min |
|
25 MHz
|
|
|
|
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