SN74LS193N
vs
5962R9580801VEX
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
TCO UP AND TCO DOWN OUTPUTS; SEPARATE UP/DOWN CLOCK
|
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
LS
|
HC/UH
|
| JESD-30 Code |
R-PDIP-T16
|
R-CDIP-T16
|
| JESD-609 Code |
e0
|
|
| Length |
19.175 mm
|
|
| Load Capacitance (CL) |
15 pF
|
|
| Load/Preset Input |
YES
|
YES
|
| Logic IC Type |
BINARY COUNTER
|
DECADE COUNTER
|
| Max Frequency@Nom-Sup |
25000000 Hz
|
|
| Max I(ol) |
0.008 A
|
|
| Mode of Operation |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Number of Bits |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
34 mA
|
|
| Propagation Delay (tpd) |
47 ns
|
34 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.44 mm
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
7.62 mm
|
|
| fmax-Min |
25 MHz
|
|
| Base Number Matches |
7
|
2
|
| Total Dose |
|
100k Rad(Si) V
|
|
|
|
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