SN74LS245N
vs
54LS245/BRA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
PLASTIC, DIP-20
|
DIP, DIP20,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH COMMON OUTPUT ENABLE AND DIRECTION CONTROL; MIN INPUT HYSTERESIS = 0.2V
|
|
| Control Type |
COMMON CONTROL
|
COMMON CONTROL
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
LS
|
|
| JESD-30 Code |
R-PDIP-T20
|
R-XDIP-T20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
26.415 mm
|
|
| Load Capacitance (CL) |
45 pF
|
|
| Logic IC Type |
BUS TRANSCEIVER
|
|
| Max I(ol) |
0.024 A
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP20,.3
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
90 mA
|
|
| Prop. Delay@Nom-Sup |
12 ns
|
|
| Propagation Delay (tpd) |
12 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
8
|
3
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|