SN74LS247DR2
vs
MC74VHC259DTR2G
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MOTOROLA INC
|
ONSEMI
|
Package Description |
SOP, SOP16,.25
|
TSSOP-16
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
RIPPLE BLANKING; LAMP TEST INPUT
|
ADDRESS LATCHES
|
Family |
LS
|
AHC/VHC
|
Input Conditioning |
STANDARD
|
STANDARD
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
e4
|
Length |
9.9 mm
|
5 mm
|
Load Capacitance (CL) |
15 pF
|
50 pF
|
Logic IC Type |
SEVEN SEGMENT DECODER/DRIVER
|
3-LINE TO 8-LINE DECODER
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Output Characteristics |
OPEN-COLLECTOR
|
|
Output Polarity |
INVERTED
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
TSSOP
|
Package Equivalence Code |
SOP16,.25
|
TSSOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Power Supply Current-Max (ICC) |
13 mA
|
|
Propagation Delay (tpd) |
100 ns
|
14.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
TTL
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
4.4 mm
|
Base Number Matches |
4
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
TSSOP-16
|
Pin Count |
|
16
|
Manufacturer Package Code |
|
948F-01
|
Factory Lead Time |
|
4 Weeks
|
Samacsys Manufacturer |
|
onsemi
|
Max I(ol) |
|
0.008 A
|
Moisture Sensitivity Level |
|
1
|
Number of Bits |
|
8
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
260
|
Prop. Delay@Nom-Sup |
|
11.5 ns
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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