SN74LS37J
vs
DM54LS37J/883
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
DIP, DIP14,.3
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-XDIP-T14
|
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Max I(ol) |
0.024 A
|
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Power Supplies |
5 V
|
|
| Prop. Delay@Nom-Sup |
24 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Schmitt Trigger |
NO
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
TTL
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Base Number Matches |
4
|
3
|
| HTS Code |
|
8542.39.00.01
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare DM54LS37J/883 with alternatives