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SN74LV273DB vs 74HC273DB,112 feature comparison

SN74LV273DB Texas Instruments

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74HC273DB,112 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Package Description SSOP, 5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LV/LV-A/LVX/H HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 7.2 mm 7.2 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 26 ns 225 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2.7 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm 5.3 mm
fmax-Min 60 MHz 24 MHz
Base Number Matches 3 1
Rohs Code Yes
Part Package Code SSOP2
Pin Count 20
Manufacturer Package Code SOT339-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP20,.3
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30
Logic » FF/Latches
Logic » FF/Latches

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Compare 74HC273DB,112 with alternatives