Findchips: Compare SN74LVC1G07DCK3 vs 74LVC1G07GW/DG,125

SN74LVC1G07DCK3 vs 74LVC1G07GW/DG,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	TEXAS INSTRUMENTS INC	NXP SEMICONDUCTORS
Package Description	SC-70, 5 PIN	TSSOP,
Reach Compliance Code	compliant	unknown
ECCN Code	EAR99
HTS Code	8542.39.00.01	8542.39.00.01
Samacsys Manufacturer	Texas Instruments
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
JESD-609 Code	e6	e3
Length	2 mm	2.05 mm
Logic IC Type	BUFFER	BUFFER
Max I(ol)	0.032 A
Moisture Sensitivity Level	1	1
Number of Functions	1	1
Number of Inputs	1	1
Number of Terminals	5	5
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	OPEN-DRAIN	OPEN-DRAIN
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	260	NOT SPECIFIED
Power Supply Current-Max (ICC)	0.01 mA
Propagation Delay (tpd)	8.6 ns	8.4 ns
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	Tin/Bismuth (Sn/Bi)	Tin (Sn)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	NOT SPECIFIED
Width	1.25 mm	1.25 mm
Base Number Matches	1	1
Pbfree Code		Yes
Part Package Code		TSSOT
Pin Count		5
Qualification Status		Not Qualified
	Logic » Gates	Logic » Gates