SN74LVC1G08YZPR vs PI74STX1G08CX feature comparison

SN74LVC1G08YZPR Rochester Electronics LLC

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PI74STX1G08CX Pericom Semiconductor Corporation

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Pbfree Code No
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC PERICOM SEMICONDUCTOR CORP
Part Package Code BGA SOIC
Package Description GREEN, DSBGA-5 TSSOP, TSSOP5/6,.08
Pin Count 5 5
Reach Compliance Code unknown compliant
Family LVC/LCX/Z STX
JESD-30 Code R-XBGA-B5 R-PDSO-G5
JESD-609 Code e1 e0
Length 1.4 mm 2 mm
Logic IC Type AND GATE AND GATE
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VFBGA TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 8 ns 7.1 ns
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 0.9 mm 1.25 mm
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Prop. Delay@Nom-Sup 4.9 ns
Qualification Status Not Qualified
Schmitt Trigger NO

Compare SN74LVC1G08YZPR with alternatives

Compare PI74STX1G08CX with alternatives