SN74LVC1G58DCKRE4 vs 74LVC1G57GW feature comparison

SN74LVC1G58DCKRE4 Texas Instruments

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74LVC1G57GW Philips Semiconductors

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Source Content uid SN74LVC1G58DCKRE4
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC PHILIPS SEMICONDUCTORS
Part Package Code SOIC
Package Description TSSOP, TSSOP6,.08
Pin Count 6
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e4 e0
Length 2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type LOGIC CIRCUIT
Max I(ol) 0.032 A 0.024 A
Moisture Sensitivity Level 1
Number of Functions 1
Number of Inputs 3
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08 TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.01 mA
Propagation Delay (tpd) 16.4 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.25 mm
Base Number Matches 1 3
Prop. Delay@Nom-Sup 7.9 ns

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