SN74LVC2G02DCUR vs 74LVC2G02DC-Q100H feature comparison

SN74LVC2G02DCUR Rochester Electronics LLC

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74LVC2G02DC-Q100H NXP Semiconductors

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Pbfree Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code SOIC SSOP
Package Description VSSOP, 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
Pin Count 8 8
Reach Compliance Code unknown compliant
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0
Length 2.3 mm 2.3 mm
Logic IC Type NOR GATE NOR GATE
Moisture Sensitivity Level 1
Number of Functions 2 2
Number of Inputs 2 2
Number of Terminals 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP VSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 8.9 ns 11.2 ns
Seated Height-Max 0.9 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 2 mm 2 mm
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT765-1
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code TSSOP8,.12,20
Packing Method TR
Prop. Delay@Nom-Sup 6.2 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Screening Level AEC-Q100