SN74LVC2G126YZPR
vs
PI74STX2G126DX
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
PERICOM SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
SOIC
|
| Package Description |
GREEN, DSBGA-8
|
VSSOP,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| Family |
LVC/LCX/Z
|
STX
|
| JESD-30 Code |
R-PBGA-B8
|
R-PDSO-G8
|
| JESD-609 Code |
e1
|
|
| Length |
1.9 mm
|
2.3 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
9.8 ns
|
13 ns
|
| Seated Height-Max |
0.5 mm
|
0.9 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
0.9 mm
|
2 mm
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare SN74LVC2G126YZPR with alternatives
Compare PI74STX2G126DX with alternatives