SN74LVC2G17YZPR
vs
74LVC2G07GW
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
GREEN, DSBGA-6
|
|
Pin Count |
6
|
|
Reach Compliance Code |
unknown
|
unknown
|
Family |
LVC/LCX/Z
|
|
JESD-30 Code |
R-XBGA-B6
|
R-PDSO-G6
|
JESD-609 Code |
e1
|
e3
|
Length |
1.4 mm
|
|
Logic IC Type |
BUFFER
|
BUFFER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
|
Number of Inputs |
1
|
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
9.3 ns
|
|
Seated Height-Max |
0.5 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
1.65 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.635 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
0.9 mm
|
|
Base Number Matches |
2
|
3
|
HTS Code |
|
8542.39.00.01
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.024 A
|
Output Characteristics |
|
OPEN-DRAIN
|
Package Equivalence Code |
|
TSSOP6,.08
|
Packing Method |
|
TR
|
Prop. Delay@Nom-Sup |
|
4.7 ns
|
Qualification Status |
|
Not Qualified
|
Schmitt Trigger |
|
NO
|
|
|
|