SN74LVC2G17YZPR
vs
SN74LVC2G17YEAR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
DSBGA
Package Description
GREEN, DSBGA-6
MO-211EA, DSBGA-6
Pin Count
6
6
Reach Compliance Code
unknown
not_compliant
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-XBGA-B6
R-XBGA-B6
JESD-609 Code
e1
Length
1.4 mm
1.4 mm
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Inputs
1
1
Number of Terminals
6
6
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
VFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Propagation Delay (tpd)
9.3 ns
9.3 ns
Seated Height-Max
0.5 mm
0.5 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
0.9 mm
0.9 mm
Base Number Matches
2
2
HTS Code
8542.39.00.01
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Package Equivalence Code
BGA6,2X3,20
Packing Method
TR
Prop. Delay@Nom-Sup
5.4 ns
Qualification Status
Not Qualified
Schmitt Trigger
YES
Compare SN74LVC2G17YEAR with alternatives