SN74LVC2G34DRL
vs
74LVC2G07GW
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
PHILIPS SEMICONDUCTORS
|
Package Description |
VSOF,
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVC/LCX/Z
|
|
JESD-30 Code |
R-PDSO-F6
|
R-PDSO-G6
|
Length |
1.6 mm
|
|
Logic IC Type |
BUFFER
|
BUFFER
|
Number of Functions |
2
|
|
Number of Inputs |
1
|
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSOF
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Propagation Delay (tpd) |
9.6 ns
|
|
Seated Height-Max |
0.6 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
1.65 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
1.2 mm
|
|
Base Number Matches |
1
|
3
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.024 A
|
Moisture Sensitivity Level |
|
1
|
Output Characteristics |
|
OPEN-DRAIN
|
Package Equivalence Code |
|
TSSOP6,.08
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
260
|
Prop. Delay@Nom-Sup |
|
4.7 ns
|
Qualification Status |
|
Not Qualified
|
Schmitt Trigger |
|
NO
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare SN74LVC2G34DRL with alternatives