SN74LVC2T45YEPR
vs
SN74LVC2T45DCURE4
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
SOIC
|
Package Description |
DSBGA-8
|
VSSOP, TSSOP8,.12,20
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
compliant
|
Additional Feature |
TWO SEPARATE CONFIGURABLE POWER SUPPLY FOR PORT A AND PORT B
|
TWO SEPARATE CONFIGURABLE POWER SUPPLY FOR PORT A AND PORT B
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PBGA-B8
|
R-PDSO-G8
|
JESD-609 Code |
e0
|
e4
|
Length |
1.9 mm
|
2.3 mm
|
Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
17.7 ns
|
17.7 ns
|
Seated Height-Max |
0.5 mm
|
0.9 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
0.9 mm
|
2 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Samacsys Manufacturer |
|
Texas Instruments
|
Control Type |
|
COMMON CONTROL
|
Count Direction |
|
BIDIRECTIONAL
|
Max I(ol) |
|
0.032 A
|
Package Equivalence Code |
|
TSSOP8,.12,20
|
Packing Method |
|
TR
|
Power Supply Current-Max (ICC) |
|
0.004 mA
|
Prop. Delay@Nom-Sup |
|
17.7 ns
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare SN74LVC2T45YEPR with alternatives
Compare SN74LVC2T45DCURE4 with alternatives