SN74LVC373AGQNR
vs
RD74LVC373BFPEL
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
BGA
|
SOIC
|
| Package Description |
PLASTIC, VFBGA-20
|
SOP, SOP20,.3
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PBGA-B20
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
|
| Length |
4 mm
|
12.6 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
SOP
|
| Package Equivalence Code |
BGA20,4X5,25
|
SOP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE
|
| Packing Method |
TR
|
TR
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Prop. Delay@Nom-Sup |
6.8 ns
|
6.9 ns
|
| Propagation Delay (tpd) |
8.2 ns
|
22.8 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
2.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
3 mm
|
5.5 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare SN74LVC373AGQNR with alternatives
Compare RD74LVC373BFPEL with alternatives