SN75LBC088FN
vs
MCP2562-E/MF
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
LCC
|
|
| Package Description |
QCCJ, LDCC84,1.2SQ
|
3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-8
|
| Pin Count |
84
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Rate |
5000 Mbps
|
1000 Mbps
|
| JESD-30 Code |
S-PQCC-J84
|
S-PDSO-N8
|
| Length |
29.3116 mm
|
3 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
84
|
8
|
| Number of Transceivers |
8
|
1
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
HVSON
|
| Package Equivalence Code |
LDCC84,1.2SQ
|
SOLCC8,.12,25
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.57 mm
|
1 mm
|
| Supply Current-Max |
0.45 mA
|
70 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Telecom IC Type |
SUPPORT CIRCUIT
|
CAN TRANSCEIVER
|
| Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
| Terminal Form |
J BEND
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
29.3116 mm
|
3 mm
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
14 Weeks, 4 Days
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Screening Level |
|
TS 16949
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
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