SNC55114J
vs
M38510/10405BEX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
DIP,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
CONFIGURABLE TOTEM-POLE OUTPUTS; DIFFERENTIAL OUTPUT PAIRS
|
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
2
|
|
| High Level Input Current-Max |
0.00004 A
|
|
| Input Characteristics |
GATED
|
DIFFERENTIAL
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
GENERAL PURPOSE
|
|
| JESD-30 Code |
R-GDIP-T16
|
R-CDIP-T14
|
| Length |
19.56 mm
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Out Swing-Min |
1.6 V
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
|
30 ns
|
| Screening Level |
MIL-STD-883 Class B (Modified)
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Transmit Delay-Max |
20 ns
|
30 ns
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare SNC55114J with alternatives
Compare M38510/10405BEX with alternatives