SNJ54HC00J vs 8403701CA feature comparison

SNJ54HC00J Rochester Electronics LLC

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8403701CA Motorola Semiconductor Products

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC MOTOROLA INC
Part Package Code DIP
Package Description HERMETIC SEALED, CERAMIC, DIP-14 ,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature LG-MAX
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14
Length 19.94 mm 8.89 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT APPLICABLE
Propagation Delay (tpd) 135 ns 135 ns
Qualification Status Not Qualified
Screening Level MIL-PRF-38535
Seated Height-Max 5.08 mm 2.03 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT APPLICABLE
Width 7.62 mm 8.89 mm
Base Number Matches 2 5
Moisture Sensitivity Level NOT APPLICABLE

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