SNJ54HC00J
vs
GD74HC00J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
LG SEMICON CO LTD
Part Package Code
DIP
Package Description
HERMETIC SEALED, CERAMIC, DIP-14
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
LG-MAX
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T14
R-XDIP-T14
Length
19.94 mm
19.939 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
135 ns
115 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
Seated Height-Max
5.08 mm
4.572 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
2
2
JESD-609 Code
e0
Max I(ol)
0.004 A
Prop. Delay@Nom-Sup
23 ns
Schmitt Trigger
NO
Terminal Finish
Tin/Lead (Sn/Pb)
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