SNJ54HC132J
vs
TC74HC132AP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TOSHIBA CORP
Part Package Code
DIP
DIP
Pin Count
14
14
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Toshiba
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
JESD-609 Code
e0
Length
19.545 mm
19.25 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.0052 A
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
TUBE
Power Supply Current-Max (ICC)
0.04 mA
Prop. Delay@Nom-Sup
37 ns
28 ns
Propagation Delay (tpd)
186 ns
140 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
YES
Seated Height-Max
5.08 mm
4.45 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Package Description
0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare SNJ54HC132J with alternatives
Compare TC74HC132AP with alternatives