SNJ54HCT00J vs GD74HCT00 feature comparison

SNJ54HCT00J Texas Instruments

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GD74HCT00 LG Semicon Co Ltd

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Source Content uid SNJ54HCT00J
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC LG SEMICON CO LTD
Part Package Code DIP
Package Description DIP, DIP14,.3
Pin Count 14
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Length 19.56 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 5 V 5 V
Prop. Delay@Nom-Sup 30 ns 24 ns
Propagation Delay (tpd) 25 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Screening Level MIL-PRF-38535
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 1 4
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

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