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SNV54HC132J vs TC74HC132AFN-ELP feature comparison

SNV54HC132J Texas Instruments

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TC74HC132AFN-ELP Toshiba America Electronic Components

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Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer TEXAS INSTRUMENTS INC TOSHIBA CORP
Part Package Code DIP SOIC
Package Description CERAMIC, DIP-14 0.150 INCH, PLASTIC, SOIC-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e0
Length 19.56 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supplies 2/6 V 2/6 V
Prop. Delay@Nom-Sup 37 ns 28 ns
Propagation Delay (tpd) 186 ns 28 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Screening Level 38535V;38534K;883S
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Packing Method TAPE AND REEL
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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