SP338EER1-L
vs
SP3243EBEA-L/TR
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
EXAR CORP
|
SIPEX CORP
|
Part Package Code |
QFN
|
|
Package Description |
HVQCCN,
|
LEAD FREE, MO-150AH, SSOP-28
|
Pin Count |
40
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
EXAR
|
EXAR
|
Differential Output |
YES
|
NO
|
Driver Number of Bits |
3
|
3
|
Input Characteristics |
DIFFERENTIAL SCHMITT TRIGGER
|
SCHMITT TRIGGER
|
Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
Interface Standard |
EIA-232; V.28
|
EIA-232-F; TIA-232-F; V.24; V.28; EIA-562; TIA-562
|
JESD-30 Code |
S-XQCC-N40
|
R-PDSO-G28
|
JESD-609 Code |
e3
|
e3
|
Length |
6 mm
|
10.2 mm
|
Moisture Sensitivity Level |
3
|
2
|
Number of Functions |
3
|
3
|
Number of Terminals |
40
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
SSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, SHRINK PITCH
|
Receive Delay-Max |
150 ns
|
|
Receiver Number of Bits |
5
|
5
|
Seated Height-Max |
1 mm
|
2 mm
|
Supply Voltage-Max |
3.465 V
|
5.5 V
|
Supply Voltage-Min |
3.135 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
DUAL
|
Transmit Delay-Max |
100 ns
|
|
Width |
6 mm
|
5.3 mm
|
Base Number Matches |
2
|
3
|
Out Swing-Min |
|
10 V
|
Output Low Current-Max |
|
0.0016 A
|
Package Equivalence Code |
|
SSOP28,.3
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
1 mA
|
Technology |
|
CMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|