SP6314USE3
vs
1N6314USE3
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
O-LALF-W2
|
O-LELF-R2
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
O-LALF-W2
|
O-LELF-R2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Reference Voltage-Nom |
3.9 V
|
3.9 V
|
Surface Mount |
NO
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
WIRE
|
WRAP AROUND
|
Terminal Position |
AXIAL
|
END
|
Working Test Current |
20 mA
|
20 mA
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Additional Feature |
|
HIGH RELIABILITY, METALLURGICALLY BONDED
|
Dynamic Impedance-Max |
|
23 Ω
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-65 °C
|
Terminal Finish |
|
PURE MATTE TIN
|
Voltage Tol-Max |
|
5%
|
|
|
|
Compare SP6314USE3 with alternatives
Compare 1N6314USE3 with alternatives