SP8400/KG/MPES
vs
SP8402/KG/MPFP
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
ZARLINK SEMICONDUCTOR INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP28,.4
|
SOP,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALL DIVISION RATIO OF 56 TO 4103 ARE AVAILABLE
|
8/16/32/64/128/256 DIVIDE RATIO SELECTION IS ALSO POSSIBLE
|
| Family |
8400
|
8402
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
| JESD-609 Code |
e0
|
e3
|
| Length |
17.9 mm
|
17.9 mm
|
| Logic IC Type |
PRESCALER
|
PRESCALER
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Data/Clock Inputs |
1
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
-10 °C
|
-10 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP28,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
152 mA
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare SP8400/KG/MPES with alternatives
Compare SP8402/KG/MPFP with alternatives