SP8853/A/DG vs SP2002BAC feature comparison

SP8853/A/DG Zarlink Semiconductor Inc

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SP2002BAC Zarlink Semiconductor Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC ZARLINK SEMICONDUCTOR INC
Package Description CERAMIC, DIL-28 PGA, PGA68,11X11
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature DUAL MODULUS PRESCALER : 8/9, 16/17
Analog IC - Other Type PLL FREQUENCY SYNTHESIZER
JESD-30 Code R-GDIP-T28 S-XPGA-P68
JESD-609 Code e0 e0
Number of Functions 1
Number of Terminals 28 68
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP PGA
Package Equivalence Code DIP28,.6 PGA68,11X11
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.59 mm
Supply Current-Max (Isup) 40 mA 1350 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology BIPOLAR ECL
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL PERPENDICULAR
Width 15.24 mm
Base Number Matches 4 3
Neg Supply Voltage-Nom (Vsup) -4.5 V

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