SP8861/NA/HP
vs
SP2002BAC
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
GEC PLESSEY SEMICONDUCTORS
|
Part Package Code |
LCC
|
|
Package Description |
QCCJ,
|
PGA, PGA68,11X11
|
Pin Count |
28
|
|
Reach Compliance Code |
unknown
|
unknown
|
Analog IC - Other Type |
PLL FREQUENCY SYNTHESIZER
|
PLL FREQUENCY SYNTHESIZER
|
JESD-30 Code |
S-PQCC-J28
|
S-CPGA-P68
|
JESD-609 Code |
e0
|
e0
|
Length |
11.505 mm
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
68
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCJ
|
PGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
|
Supply Voltage-Max (Vsup) |
5.25 V
|
|
Supply Voltage-Min (Vsup) |
4.75 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
NO
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
PIN/PEG
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
PERPENDICULAR
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
11.505 mm
|
|
Base Number Matches |
4
|
3
|
HTS Code |
|
8542.39.00.01
|
Neg Supply Voltage-Max (Vsup) |
|
-4.25 V
|
Neg Supply Voltage-Min (Vsup) |
|
-4.75 V
|
Neg Supply Voltage-Nom (Vsup) |
|
-4.5 V
|
Package Equivalence Code |
|
PGA68,11X11
|
Supply Current-Max (Isup) |
|
1350 mA
|
Technology |
|
ECL
|
|
|
|
Compare SP8861/NA/HP with alternatives
Compare SP2002BAC with alternatives