SP8861/NA/HP vs SP8853/B/DG feature comparison

SP8861/NA/HP Rochester Electronics LLC

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SP8853/B/DG Dynex Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC GEC PLESSEY SEMICONDUCTORS
Part Package Code LCC
Package Description QCCJ, DIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown unknown
Analog IC - Other Type PLL FREQUENCY SYNTHESIZER PLL FREQUENCY SYNTHESIZER
JESD-30 Code S-PQCC-J28 R-GDIP-T28
JESD-609 Code e0 e0
Length 11.505 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code QCCJ DIP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Peak Reflow Temperature (Cel) 225
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 4.57 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 11.505 mm
Base Number Matches 4 1
HTS Code 8542.39.00.01
Additional Feature SELECTABLE 16/17 OR 8/9 PRESCALER
Package Equivalence Code DIP28,.6
Supply Current-Max (Isup) 40 mA
Technology BIPOLAR

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