SS5620
vs
MMBD7000LT3
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
SENSITRON SEMICONDUCTOR
|
MOTOROLA INC
|
| Package Description |
E-LALF-W2
|
R-PDSO-G3
|
| Pin Count |
2
|
3
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.70
|
| Additional Feature |
HIGH RELIABILITY, METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
E-LALF-W2
|
R-PDSO-G3
|
| Number of Elements |
1
|
2
|
| Number of Phases |
1
|
|
| Number of Terminals |
2
|
3
|
| Output Current-Max |
1 A
|
0.2 A
|
| Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
| Package Shape |
ELLIPTICAL
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500
|
|
| Rep Pk Reverse Voltage-Max |
800 V
|
100 V
|
| Reverse Recovery Time-Max |
2 µs
|
0.004 µs
|
| Surface Mount |
NO
|
YES
|
| Terminal Form |
WIRE
|
GULL WING
|
| Terminal Position |
AXIAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
4
|
| Part Package Code |
|
SOT-23
|
| Manufacturer Package Code |
|
CASE 318-08
|
| Forward Voltage-Max (VF) |
|
1.1 V
|
| JEDEC-95 Code |
|
TO-236AB
|
| JESD-609 Code |
|
e0
|
| Non-rep Pk Forward Current-Max |
|
0.5 A
|
| Operating Temperature-Max |
|
150 °C
|
| Power Dissipation-Max |
|
0.225 W
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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