SSM2317CBZ-REEL7
vs
SSM2211CPZ-REEL7
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Part Package Code |
BGA
|
SOIC
|
Package Description |
WLCSP-9
|
3 X 3 MM, ROHS COMPLIANT, LFCSP-8
|
Pin Count |
9
|
8
|
Manufacturer Package Code |
CB-9-2
|
CP-8-13
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
Bandwidth-Nom |
20 kHz
|
20 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
Gain |
18 dB
|
|
Harmonic Distortion |
10%
|
|
JESD-30 Code |
S-PBGA-B9
|
S-PDSO-N8
|
JESD-609 Code |
e1
|
e3
|
Length |
1.46 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
3
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
9
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
3 W
|
1.5 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HVSON
|
Package Equivalence Code |
BGA9,3X3,20
|
SOLCC8,.11,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.655 mm
|
0.9 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Matte Tin (Sn)
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
1.46 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Technology |
|
CMOS
|
|
|
|
Compare SSM2317CBZ-REEL7 with alternatives
Compare SSM2211CPZ-REEL7 with alternatives