SSM2317CBZ-REEL7 vs TPA2038D1YFFR feature comparison

SSM2317CBZ-REEL7 Analog Devices Inc

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TPA2038D1YFFR Texas Instruments

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Pbfree Code No Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ANALOG DEVICES INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description WLCSP-9 VFBGA, BGA9,3X3,16
Pin Count 9 9
Manufacturer Package Code CB-9-2
Reach Compliance Code compliant compliant
HTS Code 8542.33.00.01 8542.33.00.01
Samacsys Manufacturer Analog Devices Texas Instruments
Bandwidth-Nom 20 kHz 20 kHz
Consumer IC Type CLASS D AUDIO AMPLIFIER CLASS D AUDIO AMPLIFIER
Gain 18 dB 12 dB
Harmonic Distortion 10%
JESD-30 Code S-PBGA-B9 R-XBGA-B9
JESD-609 Code e1 e1
Length 1.46 mm 1.214 mm
Moisture Sensitivity Level 1 1
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 9 9
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 3 W 3.2 W
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code VFBGA VFBGA
Package Equivalence Code BGA9,3X3,20 BGA9,3X3,16
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.655 mm 0.625 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.4 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1.46 mm 1.16 mm
Base Number Matches 1 1
ECCN Code EAR99
Noise Figure-Nom 95 dB
Supply Current-Max 2.5 mA

Compare SSM2317CBZ-REEL7 with alternatives

Compare TPA2038D1YFFR with alternatives