SSP7N55
vs
MTP6N55
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Part Package Code |
SFM
|
|
Package Description |
FLANGE MOUNT, R-PSFM-T3
|
,
|
Pin Count |
3
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
Configuration |
SINGLE
|
Single
|
DS Breakdown Voltage-Min |
550 V
|
|
Drain Current-Max (ID) |
7 A
|
|
Drain-source On Resistance-Max |
1.2 Ω
|
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-220AB
|
|
JESD-30 Code |
R-PSFM-T3
|
|
Number of Elements |
1
|
|
Number of Terminals |
3
|
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
FLANGE MOUNT
|
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
140 W
|
125 W
|
Qualification Status |
Not Qualified
|
|
Surface Mount |
NO
|
NO
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Position |
SINGLE
|
|
Transistor Element Material |
SILICON
|
|
Base Number Matches |
1
|
4
|
Rohs Code |
|
No
|
Drain Current-Max (Abs) (ID) |
|
6 A
|
|
|
|
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