SSTUAF32868AHLF vs ICSSSTUF32866EHLFT feature comparison

SSTUAF32868AHLF Integrated Device Technology Inc

Buy Now Datasheet

ICSSSTUF32866EHLFT Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA BGA
Package Description LEAD FREE, MO-246, LFBGA-176 LFBGA, BGA96,6X16,32
Pin Count 176 96
Manufacturer Package Code BKG176
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 32868 SSTU
JESD-30 Code R-PBGA-B176 R-PBGA-B96
JESD-609 Code e1 e1
Length 15 mm 13.5 mm
Logic IC Type BUS DRIVER D FLIP-FLOP
Moisture Sensitivity Level 3 3
Number of Bits 28 25
Number of Functions 1 1
Number of Terminals 176 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA176,8X22,25 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 3 ns 2.35 ns
Seated Height-Max 1.55 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 6 mm 5.5 mm
Base Number Matches 4 1
Additional Feature 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
Qualification Status Not Qualified
Technology CMOS
fmax-Min 270 MHz

Compare SSTUAF32868AHLF with alternatives

Compare ICSSSTUF32866EHLFT with alternatives