SSTUAF32868AHLF
vs
SSTUA32864BHMLF-T
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
CABGA
|
|
Package Description |
LEAD FREE, MO-246, LFBGA-176
|
TFBGA,
|
Pin Count |
176
|
|
Manufacturer Package Code |
BKG176
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
32868
|
SSTU
|
JESD-30 Code |
R-PBGA-B176
|
R-PBGA-B96
|
JESD-609 Code |
e1
|
e3
|
Length |
15 mm
|
11.5 mm
|
Logic IC Type |
BUS DRIVER
|
D FLIP-FLOP
|
Moisture Sensitivity Level |
3
|
|
Number of Bits |
28
|
25
|
Number of Functions |
1
|
1
|
Number of Terminals |
176
|
96
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
TFBGA
|
Package Equivalence Code |
BGA176,8X22,25
|
BGA96,6X16,25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
3 ns
|
1.9 ns
|
Seated Height-Max |
1.55 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
6 mm
|
5 mm
|
Base Number Matches |
4
|
4
|
Qualification Status |
|
Not Qualified
|
fmax-Min |
|
410 MHz
|
|
|
|
Compare SSTUAF32868AHLF with alternatives
Compare SSTUA32864BHMLF-T with alternatives